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How do you tell a good heatsink from a poor one, and, more importantly, what makes a heatsink work? Is it the material used, the way it is built, or simply how powerful its fans are? These questions come up quite often; people ask if they should spend that extra cash on a heatsink made out of some special material. Is there any performance gain if your heatsink is made out of copper? Does this really affect performance that much? I’ll try to shed some light on things, and give you the lowdown on how to tell a good heatsink from a poor one.

Not a lot has changed since then on the theoretical side of things; heatsinks with lots of fine fins or pins are still better than the ones with a few thick ones, and small heatsinks don't suddenly outperform big heatsinks. What has changed, however, is the CPUs we are using them on, with the Pentium III going mainstream, no longer just being the CPU of choice for the big-budget computer user. With the Pentium II and Slot 1 Celerons slowly being phased out, the heatsink manufacturers have released models adapted to this new mainstream CPU. As the Intel Pentium III is the most popular CPU on the market, most heatsink manufacturers have at least one model that will fit this CPU. Furthermore all Intel CPU’s in the ‘Boxed’ version come with attached heatsink. So what is actually the difference between a Pentium III heatsink, also known as a SECC2 heatsink, and a Pentium II, SECC1 heatsink? If you look at the Pentium III cartridge you can see that it is a lot more open than the Pentium II cartridge. With an OEM CPU, or with heatsink detached , you can actually look right at the CPU and the cache chips. The way the Pentium II SECC1 cartridge was constructed actually wasn’t that good a thermal solution. The CPU and cache chips were enclosed within the cartridge and the CPU was thermally interfaced with an aluminum backplate onto which the heatsink was attached. This might seem reasonable, but if you are trying to keep the CPU temperature as low as possible you must keep the thermal resistance as low as possible.

Thermal resistance is the (in)ability of the heat generated to dissipate, as measured in K/W (Kelvin per Watt), an indication of the heat pumping ability of the heatsink. Obviously you want this value to be as low as possible, so you want the minimum of material between the CPU and the actual cooling device; in an ideal situation the CPU and the cooling device will be directly thermally interfaced. Basically that’s the way the Pentium III , SECC2 cartridge is constructed, the CPU core is interfaced directly with the heatsink, even without the copper heatspreader, or slug, as found on the Pentium II.

With the 386 processor, there wasn't a need for a special cooling system. The chip was slow and did not have many transistors, therefore the air flow from the power supply was enough to cool the chip. With the release of the 486, cooling became an issue. With the slower 486s, it wasn't a really big deal, but with the 486DX-66, cooling was an issue. This clock doubled chip got pretty hot. From then on, chips ran faster and hotter. All chips used today require a special cooling system. The type of processor is the biggest variable in the amount and type of cooling needed. Run-of-the-mill fans could not keep it cool enough, so Cyrix had to design a special heat sink and fan to keep their chip cool.